Substrate Material Impacts PCB Assembly Processes
The choice of substrate material has a significant impact on how a PCB assembly is performed, and the overall design. As emerging technologies like IoT and 5G continue to shape the future of electronic devices, PCBs will need to be made more compact and energy-efficient while providing the necessary strength to support their functionality. This is where the substrate comes in, providing a foundation for all other layers of a printed circuit board assembly. By understanding how different types of substrates affect their assembly processes, manufacturers can select the best materials to meet the needs of future applications.
The most popular type of PCB substrate is FR-4, a glass-reinforced epoxy laminate. It offers an excellent balance of electrical insulation, mechanical strength, and cost-effectiveness, making it suitable for a wide range of electronics. In addition, FR-4 provides chemical resistance and moisture resistance, preventing delamination and other issues caused by water ingress.
Other popular choices include PTFE resins, which have the highest dielectric constant and low dissipation factor of all the options. However, they are quite expensive and do not exhibit good rigidity or a high coefficient of thermal expansion. Nonetheless, they offer a high degree of performance for frequencies between 1 and 10GHz.
When choosing a PCB substrate, it is important to consider its maximum operating temperature (MOT), as well as the length of time that this temperature can be maintained without affecting the characteristics of the material. The MOT is typically printed on the product label.
How the Choice of Substrate Material Impacts PCB Assembly Processes
In addition to the MOT, it is also crucial to consider a substrate’s glass transition temperature (Tg), as well as its decomposition temperature and coefficient of thermal expansion (CTE). The Tg is the temperature at which a substrate will soften and lose its structural integrity, while the decomposition temperature indicates when the material will chemically decompose. The CTE is a measure of how much a substrate will expand or contract as it heats up and cools down, which can affect the alignment of copper layers within a layer.
Once a substrate is selected, it must be coated with a copper layer through a process known as copper cladding. This step ensures that conductive pathways are established between different layers of the circuit board. After this, holes, called vias and through-holes, are drilled into the surface. This allows for the connection of components, ensuring that the circuit board can perform its intended function.
Lastly, it is critical to choose a substrate material that is RoHS-compliant, as this will ensure that the material does not pose any hazards to human health or the environment. This will help to avoid environmental regulations violations and other costly penalties. For this reason, it is essential to work with a qualified PCB manufacturer to ensure that all regulatory requirements are met.
